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BAW Devices Dia 50.8mm 1 Inch AlN Aluminum Nitride Wafer

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BAW Devices Dia 50.8mm 1 Inch AlN Aluminum Nitride Wafer

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Brand Name : ZMKJ

Model Number : UTI-AlN-1inch single crystal

Place of Origin : China

MOQ : 1pcs

Price : by case

Payment Terms : T/T, Western Union, paypal

Supply Ability : 10pcs/month

Delivery Time : in 30days

Packaging Details : single wafer container in cleaning room

material : AlN crystal

thickness : 400um

Orientation : 0001

application : high power/high frequency electronic devices

application 2 : 5G saw/BAW Devices

Ra : 0.5nm

surface polished : Al face cmp, N-face mp

crystal type : 2H

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dia50.8mm 2inch 1inch AlN substrate/AlN single crystal wafers

10x10mm or diameter 10mm dia25.4mm dia30mm, dia45mm, dia50.8mm  AlN substrate AlN single crystal wafers

 

Applications of   AlN template
 
we have developed a serials of proprietary processes and technologies to fabricate
high-quality AlN templates. At present, Our OEM is the only company worldwide who can produce 2-6 inch AlN
templates in large-scale industrial production capability with capacity of 300,000 pieces in 2020 to meet explosive
market demand from UVC-LED, 5G wireless communication, UV detectors and sensors etc
 
We currently provide customers with standardized 10x10mm/Φ10mm/Φ15mm/Φ20mm/Φ25.4mm/Φ30mm/Φ50.8mm high quality nitrogen
Aluminum single crystal substrate products, and can also provide customers with 10-20mm non-polar
M-plane aluminum nitride single crystal substrate, or customize non-standard 5mm-50.8mm to customers
Polished aluminum nitride single crystal substrate. This product is widely used as a high-end substrate material
Used in UVC-LED chips, UV detectors, UV lasers, and various high power
/High temperature/high frequency electronic device field.
 
 
Characteristic Specification
  • Model                                                           UTI-AlN-10x10B-single crystal
  • Diameter                                                           10x10±0.5mm ; or dia10mm,  dia25.4mm, or dia30mm, or dia45mm; 
  • Substrate thickness (µm)                                      400 ± 50
  • Orientation                                                        C-axis [0001] +/- 0.5°

     Quality Grade              S-grade(super)    P-grade(production)       R-grade(Research) 

  • Cracks                                                  None                      None                                   <3mm 
  • FWHM-2θXRD@(0002)                  <150                            <300                                    <500
  • FWHM-HRXRD@(10-12)                 <100                         <200                                     <400
  • Surface Roughness [5×5µm] (nm)          Al-face  CMP <0.5nm;     N-face(back surface) MP <1.2um; 
  • Usable area                                       90%
  • Absorbance                              <50 ;                   <70 ;                              <100;
  • 1st  OF length orientation                                         {10-10} ±5°;
  • TTV (µm)                                                                       ≤30
  • Bow (µm)                                                                        ≤30
  • Warp (µm)                                                                    -30~30
  • Note: These characterization results may vary slightly depending on the equipments and/or software employed
BAW Devices Dia 50.8mm 1 Inch AlN Aluminum Nitride Wafer

BAW Devices Dia 50.8mm 1 Inch AlN Aluminum Nitride Wafer

BAW Devices Dia 50.8mm 1 Inch AlN Aluminum Nitride Wafer

 

BAW Devices Dia 50.8mm 1 Inch AlN Aluminum Nitride Wafer

BAW Devices Dia 50.8mm 1 Inch AlN Aluminum Nitride Wafer

 
impurity element    C O Si B Na W P S Ti Fe
PPMW                        27 90 5.4 0.92 0.23 <0.1 <0.1 <0.5 0.46 <0.5
 
 
Crystal structure

Wurtzite

Lattice constant (Å) a=3.112, c=4.982
Conduction band type Direct bandgap
Density (g/cm3) 3.23
Surface microhardness (Knoop test) 800
Melting point (℃) 2750 (10-100 bar in N2)
Thermal conductivity (W/m·K) 320
Band gap energy (eV) 6.28
Electron mobility (V·s/cm2) 1100
Electric breakdown field (MV/cm) 11.7

BAW Devices Dia 50.8mm 1 Inch AlN Aluminum Nitride Wafer


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